Gigabyte
Aorus Series Intel B760 Socket LGA1700 ATX Motherboard (B760 AORUS MASTER DDR4)

Gigabyte B760 AORUS MASTER DDR4 (rev. 1.0)

• Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors
• Unparalleled Performance：Twin 16*+1+1 Phases Digital VRM Solution
• Dual Channel DDR4：4*DIMMs with XMP Memory Module Support
• Next Generation Storage：3*PCIe 4.0 x4 M.2 Connectors
• Advanced Thermal Design & M.2 Thermal Guard：To Ensure VRM Power Stability & M.2 SSD Performance
• EZ-Latch Plus：M.2 Connectors with Quick Release & Screwless Design
• Fast Networks：Intel® 2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax
• Extended Connectivity：Front USB-C® 10Gb/s, Rear USB-C® 20Gb/s, DP, HDMI
• Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP and Noise Detection
• Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card

• * 8+8 phases parallel power design

UNPARALLELED PERFORMANCE

Twin Digital VRM Design

To ensure maximum Turbo Boost and overclocking performance of Intel's new generation CPU, GIGABYTE AORUS series motherboard equip the best VRM design ever built with the highest quality components.

Support for DDR4 XMP Up to 5333Mhz and Beyond*

AORUS is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their AORUS motherboard.

* XMP Profile support may vary depending on memory module. Please see the complete validated memory support list. Product features may vary by model.

Triple PCIe 4.0 x4 M.2 Connectors with Thermal Guard

AORUS Gaming Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their Systems' potential.

GIGABYTE PerfDrive

PerfDrive technology integrates multiple GIGABYTE exclusive BIOS settings to allow users to balance between different levels of performance, power consumption, and temperature according to their needs easily when using 13th gen Intel® Core™ processors.

* Features and function vary depending on Motherboard and CPU specifications, image is for reference only.

OUTSTANDING THERMAL DESIGN

Thermal Design

• Fully Covered Thermal Design
• Enlarged Thermal Guard
• 4 W  /mK Thermal Pad
• 6-Layer & 2 x Copper PCB

Fully Covered MOSFET Heatsink

2 x Large Surface

Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build

TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design.

Multi-Cut Design

TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.